设备参数概述Overview of the device parameters

行程stroke

X轴/Z轴：220mmX-axis / Z axis: 220mm

主轴速度Spindle speed

SP-150=7,000rpm

研磨主轴速度Grinding spindle speed

50,000rpm

回转直径Turning diameter

250mm/222mmm(在可选B轴上）(Optional B-axis)

位置反馈分辨率Position feedback resolution

0.016μm

形状误差Form error

＜0.05μm/25mm

表面粗糙度Surface roughness

＜5nm Ra

功能概述Functional Overview

单点金刚石车削Single point diamond turning

用于光学器件和光学模具的车床加工，
包括自由形态非轴对称设计和自由曲面For optical devices and optical mold lathing,
Including non-axisymmetric free-form design and free-form surfaces

自由形态磨削和铣削Free-form grinding and milling

利用50000RPM的主轴和旋转B轴进行平行磨削或45度磨削
，用于光学模芯磨削（如用于玻璃热模压用的碳化钨材料）Use 50000RPM spindle and rotary axis B parallel or 45 degrees
grinding ，For the optical core grinding (eg for hot glass molding material with tungsten carbide)